this is information on a product in full production. november 2013 docid17735 rev 2 1/9 byw81hr aerospace 1 x 15 a and 2 x 15 a - 200 v fast recovery rectifier datasheet - production data features ? very small conduction losses ? negligible switching losses ? high surge current capability ? high avalanche energy capability ? hermetic packages ? target radiation qualification: ? 150 krad (si) low dose rate ? 1 mrad high dose rate ? escc qualified description packaged in hermetic to-254 or smd.5, this device is intended for use in medium voltage, high frequency switching mode power supplies, high frequency dc to dc converters, and other aerospace applications. the complete escc specification for this device is available from the european space agency web site. st guarantees full compliance of qualified parts with such escc detailed specifications. figure 1. device configuration to-254 smd.5 1 2 3 2 1 3 variant 03 byw81-200cfsy1 variant 05 byw81-200shrb terminal 1: terminal 2: terminal 3: the case is not connected to any lead terminal 1: terminal 2: terminal 3: the lid is not connected to any terminal anode a common cathode anode b anode anode cathode table 1. device summary (1) order code escc part number quality level eppl package i f(av) v rrm v f (max) t j(max) byw81-200cfsy1 - engineering model - to-254 2 x 15 a 200 v 1.15 v 150 c byw81-200cfsyhrb 5103/029/03 escc flight - to-254 2 x 15 a byw81-200shrb 5103/029/05 escc flight y smd.5 15 a 1. contact st sales office for information about th e specific conditions for products in die form. www.st.com
characteristics byw81hr 2/9 docid17735 rev 2 1 characteristics table 2. absolute maximum ratings symbol characteristic value unit i fsm forward surge current (1) (2) variant 05 variant 03 (per diode) variant 03 (per device) 250 250 500 a v rrm repetitive peak reverse voltage (3) 200 v i o average output rectified current (50% duty cycle) (2)(4) variant 05 variant 03 (per diode) variant 03 (per device) 15 15 30 a i f(rms) forward rms current (per diode) (2) variant 05 variant 03 (per diode) variant 03 (per device) 30 30 40 a t op operating case temperature range (5) -55 to +150 c t j junction temperature +150 c t stg storage temperature range (5) -55 to +150 c t sol soldering temperature to-254 (6) smd.5 (7) +260 +245 c 1. sinusoidal pulse of 10 ms duration 2. for variant 03 the ?per device? ratings apply onl y when both cathode terminals are tied together. 3. pulsed, duration 5 ms, f = 50 hz 4. for t case ??? +110c, derate linearly to 0 a at +150c. 5. for devices with hot solder dip le ad finish all testing performed at t amb > +125 c are carried out in a 100% inert atmosphere. 6. duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be re-soldered until 3 minutes have elapsed. 7. duration 5 seconds maximum the same package sh all not be re-soldered unti l 3 minutes have elapsed. table 3. thermal resistance symbol parameter value unit r th (j-c) (1) junction to case all variants (per diode) variant 03 (per device) (2) 2.3 1.4 ? c/w 1. package mounted on infinite heatsink. 2. for variant 03 the ?per device? ratings apply onl y when both cathode terminals are tied together.
docid17735 rev 2 3/9 byw81hr characteristics 9 s table 4. electrical measurements at ambient temperature (per diode), t amb = 22 3 c symbol characteristic mil-std-750 test method test conditions limits units min. max. i r reverse current 4016 dc method, v r = 200 v - 20 a v f1 (1) forward voltage 4011 pulse method, i f = 10 a - 1.0 v v f2 (1) pulse method, i f = 20 a - 1.2 v v br breakdown voltage 4021 i r = 100 a 200 - v c capacitance 4001 v r = 10 v, f = 1 mhz - 220 pf t rr reverse recovery time 4031 i f = 1 a, v r = 30 v, di f /dt = -50 a/s -40ns z th(j-c) (2) relative thermal impedance, junction to case 3101 i h = 15 to 40 a, t h = 50 ms i m = 50 ma, t md = 100 s calculate ? v f (3) c/w 1. pulse width ? 680s, duty cycle ? 2% 2. performed only during screening tests parameter dr ift values (initial me asurements), go-no-go. 3. the limits for ? vf shall be defined by the manufacturer on every lot in accordance with mil-std-750 method 3101 and shall guarantee the r th(j-c) limits specified in maximum ratings. table 5. electrical measurements at high and low temperatures (per diode) symbol characteristic mil-std-750 test method test conditions (1) limits units min. max. i r reverse current 4016 t case = +125 (+0, -5) c dc method, v r = 200 v -10ma v f1 (2) forward voltage 4011 t case = +125 (+0, -5) c pulse method, i f = 10 a -0.85v t case = +55 (+0, -5) c pulse method, i f = 10 a -1.15v 1. read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. alternatively a 100% inspection may be performed. 2. pulse width ? 300s, duty cycle ? 2%
package information byw81hr 4/9 docid17735 rev 2 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 2. metal flange mount package (to-254 (a) ) 3 lead, dimension definitions a. the terminal identification is specif ied by the device configuration. see figure for terminal connections b a c d e ?f g h ?i j k k l ?m n r1 r2 1 2 3
docid17735 rev 2 5/9 byw81hr package information 9 table 6. metal flange mount package (to-254) 3-lead, dimension values reference dimension in millimeters dimension in inches min. max. min. max. a 13.59 13.84 0.535 0.545 b 13.59 13.84 0.535 0.545 c 20.07 20.32 0.790 0.800 d 6.3 6.7 0.248 0.264 e 1 1.35 0.039 0.053 ?f 3.5 3.9 0.138 0.154 g 16.89 17.4 0.665 0.685 h 6.86 bsc 0.270 bsc ?i (1) 0.89 1.14 0.035 0.045 j 3.81 bsc 0.150 bsc k 3.81 bsc 0.150 bsc l 12.95 14.5 0.510 0.571 ?m 3.05 typ. 0.120 typ. n - 0.71 - 0.028 r1 (2) -1-0.039 r2 (3) 1.65 typ. 0.065 1. 3 locations 2. radius of heatsink flange corner - 4 locations 3. radius of body corner - 4 locations
package information byw81hr 6/9 docid17735 rev 2 figure 3. surface mount package (smd .5) 3-terminal, dimension definitions table 7. surface mount package (smd.5) 3-terminal, dimension values reference dimension in millimete rs dimension in inches min. max. min. max. a 2.84 3.15 0.112 0.124 a1 0.25 0.51 0.010 0.20 b 7.13 7.39 0.281 0.291 b1 5.58 5.84 0.220 0.230 b2 (1) 1. 2 locations 2.28 2.54 0.090 0.100 b3 (1) 2.92 3.18 0.115 0.125 d 10.03 10.28 0.395 0.405 d1 (1) 0.76 - 0.030 - e 7.39 7.64 0.291 0.301 e (1) 1.91 bsc 0.075 1 2 3 a a1 b b1 b2 b3 d1 e e d
docid17735 rev 2 7/9 byw81hr ordering information 9 3 ordering information 4 other information 4.1 date code date code is structured as describe below: ? em xyywwz ? escc flight yywwz where: ? x (em only): 3, assembly location rennes (france) ? yy: last two digits year ? ww: week digits ? z: lot index in the week 4.2 documentation in table 9 is a summary of the documentation provided with each type of products. table 8. ordering information (1) order code escc part number quality level package lead finish marking (2) mass packing byw81-200cfsy1 - engineering model to-254 gold byw81200cfsy1 + beo 10 g strip pack byw81-200fsyhrb 5103/029/03 escc flight to-254 solder dip 510302901 + beo byw81-200shrb 5103/029/05 escc flight smd.5 gold 510302905 2.0 g 1. contact st sales office for information about th e specific conditions for products in die form. 2. specific marking only. the fu ll marking incl udes in addition: for the engineering models: st logo, date code, country of origin (fr). for escc flight parts: st logo, date code, country of origin (f r), esa logo, serial number of the part within the assembly lot. table 9. documentation provided with each type of products quality level documentation engineering model escc flight certificat e of conformance
revision history byw81hr 8/9 docid17735 rev 2 5 revision history table 10. document revision history date revision changes 3-nov-2010 1 first issue. 8-nov-2013 2 inserted other information
docid17735 rev 2 9/9 byw81hr 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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